Microstructural simulation of dynamic recrystallization
نویسندگان
چکیده
منابع مشابه
Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Solder alloys are widely used bonding materials in electronics industry. The reliability con‐ cerns for solder interconnections, which provide both mechanical and electronic connec‐ tions, are rising with the increasing use of highly integrated components in portable electronic products [1-6]. As shown in Fig. 1, a typical ball grid array (BGA) component board usually consists of a silicone die...
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The aim of the present study is the prediction of critical conditions (including critical strain and flow stress) for the initiation of dynamic recrystallization during thermo-mechanical processing of plain carbon steels. For this propose, torsion tests were conducted at different temperature (1050, 1100 and 1150˚C) and strain rates (0.002, 0.02 and 0.2/s). All flow curves showed a peak st...
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ژورنال
عنوان ژورنال: Acta Metallurgica et Materialia
سال: 1992
ISSN: 0956-7151
DOI: 10.1016/0956-7151(92)90198-n